Solder Paste Inspection Solutions - MEK

 5D Solder Paste Inspection System  

• Maximum PCB Size: 510 mm x 460 mm 20.1 inch x 18.1 inch  
•  Minimum PCB Thickness: Min  0.3mm (11.8 mils)   to Max 4.0mm (157.5 mils)                
• Minimum component size:  01005 chip 18/9 micron lens 008005 with optional 12/6 micron lens  
• Minimum Pad SIze:  200µm (4 mils) diameter in normal mode (18 Micron lens) 150 micron (12 micron lens)
• Maximum Paste Height: 600µm (23.6 mils)    
• Maximum PCB Warp:   ±6mm (240 mils)  
• Camera:  Patented advanced 5D sensor  
• Lens Type:  High Grade Telecentric