5D Solder Paste Inspection System S2
5D Solder Paste Inspection System S2
5D Solder Paste Inspection System
- Maximum PCB Size: 510 mm x 460 mm 20.1 inch x 18.1 inch
- Minimum PCB Thickness: Min 0.3mm (11.8 mils) to Max 4.0mm (157.5 mils)
- Minimum component size: 01005 chip 18/9 micron lens 008005 with optional 12/6 micron lens
- Minimum Pad SIze: 200µm (4 mils) diameter in normal mode (18 Micron lens) 150 micron (12 micron lens)
- Maximum Paste Height: 600µm (23.6 mils)
- Maximum PCB Warp: ±6mm (240 mils)
- Camera: Patented advanced 5D sensor
- Lens Type: High Grade Telecentric