ADVANCED SEMICONDUCTOR PACKAGING
ADVANCED SEMICONDUCTOR PACKAGING
ADVANCED SEMICONDUCTOR PACKAGING
ADVANCED SEMICONDUCTOR PACKAGING
- Fuzion Platform
- Bare-Die Feeding Solutions
Supported Applications
- Mixed Assemblies (SMT+ Bare-Die)
- WLP (Wafer Level Packaging)
- Fan-In, Fan-Out
- Flip-Chip
- POP, SIP
- FHE (Flexible Hybrid Electronics)
- CoW / DoW (Chip / Die on Wafer)
- TAP (Top Alignment Process)
- DBC / Lead Frame
- IGBT / IGFET
- FPGAs
- PMIC
- MEMS