Advanced Packaging - Universal Instruments

 ONE solution For all advanced packaging challenges

• Accuracy: 10um, speed: 10K cph, area:  813 x 625mm
• Any feeding option (wafer, tray, tape, tube, bulk, direct die)
• Place high-accuracy actives and passives on one platform
• Pick and place on any substrate, including thin/flex

ADVANCED SEMICONDUCTOR PACKAGING

• Fuzion Platform
• Bare-Die Feeding Solutions

Supported Applications

• Mixed Assemblies (SMT+ Bare-Die)
• WLP (Wafer Level Packaging)
• Fan-In, Fan-Out
• Flip-Chip
• POP, SIP
• FHE (Flexible Hybrid Electronics)
• CoW / DoW (Chip / Die on Wafer)
• TAP (Top Alignment Process)
• DBC / Lead Frame
• IGBT / IGFET
• FPGAs
• PMIC
• MEMS