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Advanced Packaging
FuzionSC Platform
Innova Direct Die Feeder
FuzionSC Platform
- Silicon/SMT, high-accuracy/high-speed assembly
- High accuracy: (±10µm, < 3µm placement repeatability)
- Dual- or single-beam, multiple-spindle heads
- Full range of die and component types and sizes
- Versatile substrate handling
- Broadest range of feeding platforms
- Low-maintenance, accurate over time
- Vision robustness recognition of pins or logic pads
- Stacking support (POP)
- Low-force capability
Innova Direct Die Feeder
FuzionSC Platform
Innova Direct Die Feeder
Innova Direct Die Feeder
Innova Direct Die Feeder
- Ideal for SiP applications
- High-mix to high-volume support
- Handles up to 300mm wafers
- Inline barcode scanning supports ALPs or Inkless wafer maps
- Supports up to 4 per machine